Precision Laser Cutting, drilling, scribing on ceramic substrates

Ceramic is a kind of functional material with high melting point, high hardness, high wear resistance and oxidation 

resistance. stiffness, strength, plasticity free, high thermal stability and high chemical stability, it’s also a good

insulator and become the the standard materials for electronic circuit carriers. It is often used in military industry, 

aerospace, high-end PCB, 3C industry and so on, mainly include oxide ceramics, carbide ceramics, metal ceramics, 

nitride ceramics, etc., with special mechanical, optical, acoustic, electrical, magnetic, thermal and other characteristics.

Due to the ceramic material's function and characteristics, it require high precision processing, high quality, fast 

speed. The traditional machining is mainly CNC machining, the speed and accuracy is low, which is not suitable for 

high precision processing demand. So the laser cutting technology is developed for ceramic cutting, scribing, drilling.

Ceramics Overview

Ceramics are inorganic materials that are both hard and brittle. Ceramics offer excellent thermal and electrical insulation properties. Examples of common ceramics include alumina (Al2O3), porcelain (Al2Si2O5(OH)), zirconia (ZrO2), earthenware, silicon carbide (SiC), and ceramic tile. Laser processing of ceramics is typically performed using a 10.6 or 9.3 micron CO2 laser with some ceramics also absorbing a 1.06 micron fiber laser wavelength. Laser cutting of thin film ceramic is also possible using a CO2 laser, producing a clean edge with little discoloration. Laser engraving of ceramics is achieved using a CO2 laser. This process results in a shallow textured depth that can be used to create intricate patterns and detailed images. Laser marking can be accomplished using a 1.06 micron fiber laser on certain ceramics, such as alumina, tungsten carbide (WC) and zirconia, to produce a dark, uniform surface mark.